Method for fabricating a heterojunction schottky gate bipolar transistor

ABSTRACT

Certain embodiments of the present invention may be directed to a transistor structure. The transistor structure may include a semiconductor substrate. The semiconductor substrate may include a drift region, a collector region, an emitter region, and a lightly-doped/undoped region. The lightly-doped/undoped region may be lightly-doped and/or undoped. The transistor structure may also include a heterostructure. The heterostructure forms a heterojunction with the lightly-doped/undoped region. The transistor structure may also include a collector terminal. The collector terminal is in contact with the collector region. The transistor structure may also include a gate terminal. The gate terminal is in contact with the heterostructure. The transistor structure may also include an emitter terminal. The emitter terminal is in contact with the lightly-doped/undoped region and the emitter region.

CROSS REFERENCE TO RELATED APPLICATION

This application is a divisional application that claims priority toU.S. non-provisional application Ser. No. 15/149,979, filed on May 9,2016. The entire content of the above-referenced application is herebyincorporated by reference.

BACKGROUND Field

Certain embodiments of the present invention may relate to aheterojunction schottky gate bipolar transistor.

Description of the Related Art

Certain embodiments of the present invention provide improvements overtraditional insulated-gate bipolar transistors. An insulated-gatebipolar transistor is generally understood as a three-terminal powersemiconductor device that may operate as an electronic switch. Theinsulated-gate bipolar transistor can generally provide switching thatoccurs in a fast manner, with good efficiency. Insulated-gate bipolartransistors have been used in a wide variety of modern appliances.

SUMMARY

According to a first embodiment, a transistor structure may include asemiconductor substrate. The semiconductor substrate may include a driftregion, a collector region, an emitter region, and alightly-doped/undoped region. The lightly-doped/undoped region may belightly-doped and/or undoped. The transistor structure may also includea heterostructure. The heterostructure may form a heterojunction withthe lightly-doped/undoped region. The transistor structure may alsoinclude a collector terminal. The collector terminal is in contact withthe collector region. The transistor structure may also include a gateterminal. The gate terminal is in contact with the heterostructure. Thetransistor structure may also include an emitter terminal. The emitterterminal may be in contact with the lightly-doped/undoped region and theemitter region.

In the transistor structure of the first embodiment, the drift regionmay include an N− doped region.

In the transistor structure of the first embodiment, the collectorregion may include a P+ doped region.

In the transistor structure of the first embodiment, the emitter regionmay include an n+ doped region.

In the transistor structure of the first embodiment, the semiconductorsubstrate may include Gallium arsenide.

In the transistor structure of the first embodiment, the heterostructuremay include Aluminum gallium arsenide.

In the transistor structure of the first embodiment, the heterostructuremay be n+ doped.

In the transistor structure of the first embodiment, the transistorstructure may be configured to be optically-controllable viaillumination upon the gate terminal.

In the transistor structure of the first embodiment, a quantum wellcorresponding to the heterojunction may provide a low resistance channelfor a flow of electrons.

According to a second embodiment, a method for fabricating a transistorstructure may include performing a photolithography process to transfera device pattern onto a semiconductor substrate. The semiconductorsubstrate may include a drift region and a lightly-doped/undoped region,and the lightly-doped/undoped region may be lightly-doped and/orundoped. The method may also include doping a collector region of thesubstrate. The method may also include doping an emitter region of thesubstrate. The method may also include forming a heterostructure. Theheterostructure may form a heterojunction with the lightly-doped/undopedregion. The method may also include forming a collector terminal. Thecollector terminal may be in contact with the collector region. Themethod may also include forming a gate terminal. The gate terminal maybe in contact with the heterostructure. The method may also includeforming an emitter terminal. The emitter terminal may be in contact withthe lightly-doped/undoped region and the emitter region.

In the method of the second embodiment, the drift region may include anN− doped region.

In the method of the second embodiment, the doping the collector regionmay include performing P+ doping.

In the method of the second embodiment, the doping the emitter regionmay include performing n+ doping.

In the method of the second embodiment, the semiconductor substrate mayinclude Gallium arsenide.

In the method of the second embodiment, the forming the heterostructuremay include forming a heterostructure comprising Aluminum galliumarsenide.

In the method of the second embodiment, the forming the heterostructuremay include forming a heterostructure comprising an n+ dopedheterostructure.

In the method of the second embodiment, fabricating the transistorstructure includes fabricating a structure that may beoptically-controllable via illumination upon the gate terminal.

In the method of the second embodiment, fabricating the transistorstructure may include fabricating a structure where a quantum wellcorresponding to the heterojunction provides a low resistance channelfor a flow of electrons.

BRIEF DESCRIPTION OF THE DRAWINGS

For proper understanding of the invention, reference should be made tothe accompanying drawings, wherein:

FIG. 1 illustrates a cross section view of a Heterojunction SchottkyGate Bipolar Transistor (HSGBT), in accordance with certain embodimentsof the present invention.

FIG. 2 illustrates doping densities in different regions of a siliconplanar insulated-gate bipolar transistor (IGBT).

FIG. 3 illustrates doping densities in different regions of a GalliumArsenide (GaAs) IGBT.

FIG. 4 illustrates doping densities in the different regions of an HSGBTdevice, in accordance with certain embodiments of the present invention.

FIG. 5(a) illustrates a current in an HSGBT device, when controlledelectrically, in accordance with certain embodiments.

FIG. 5(b) illustrates a current in an HSGBT device when, controlledoptically, in accordance with certain embodiments.

FIG. 6 illustrates a method of fabricating a device, in accordance withcertain embodiments of the present invention.

DETAILED DESCRIPTION

Traditional silicon planar insulated-gate bipolar transistors (IGBT) areimportant components within power integrated circuits. Certainembodiments are directed to a power device that may be referred to as aHeterojunction Schottky Gate Bipolar Transistor (HSGBT), which mayprovide improvements over the traditional silicon planar IGBT. Comparedto traditional IGBT, the HSGBT of certain embodiments may have thepotential to carry a level of current that is at least 1000 timesgreater than the current that is carried by Si IGBT, and greater thanthe current that is carried by GaAS IGBT, of similar dimensions.

The HSGBT device of certain embodiments may form a quantum well byforming a junction between a first semiconductor material and a second,different semiconductor material. For example, the HSGBT device ofcertain embodiments may form a quantum well by forming a junctionbetween Aluminum gallium arsenide (AlGaAs) and Gallium arsenide (GaAs).The quantum well may be formed in the conduction band of very lightlydoped Gallium Arsenide (GaAs). The quantum well may provide a lowresistance channel for the flow of electrons from a collector to anemitter of the HSGBT, thereby increasing the amount of current flow.

The HSGBT device of certain embodiments may form a quantum well byforming a junction between a heavily doped wider bandgap material (suchas AlGaAs, for example) and a lightly doped/undoped narrower bandgapmaterial (such as GaAs, for example). Forming this junction results inthe formation of the quantum well in the GaAs, near the junction. Thisquantum well has a relatively higher concentration of electrons than theadjoining GaAs because of a real-space charge-carrier transfer ofelectrons from AlGaAs.

The electrons in this quantum well have a higher mobility because ofreduced electron-ionized impurity scattering. Therefore, the electronsmove relatively faster upon the application of electric field, resultingin lower resistance and, therefore, higher current. With certainembodiments of the present embodiment, the width of the quantum well maybe approximately 0.5 micrometers (microns) wide. Changing the dopingdensity of the AlGaAs layer by an order of 10 was generally not seen toresult in any significant change in the performance of the device. Thewidth of the quantum well may be determined based on the band gapdifferences of GaAs and AlGaAs.

The HSGBT device of certain embodiments may also have the potential tobe optically controllable. For example, certain embodiments may beoptically controlled by light in the visible spectrum. Specifically, thecurrent flow of the HSGBT device can be controlled, based upon thecharacteristics of light that is incident upon the HSGBT device. Assuch, certain embodiments may be directed to a device that can bereferred to as an optically-controlled HSGBT (OC HSGBT). The light thatfalls on the HSGBT device generates additional electron-hole pairs. Thelight also increases the number of electrons in the quantum well fromthe transfer of electrons from AlGaAs to the quantum-well. This increasein the total electrons, therefore, has the effect of further loweringthe resistance of the channel, and therefore increasing the current.

By being optically controllable, the devices of certain embodiments maybe suitable for use in high-power opto-electronic communicationcircuits, in addition to being suitable for use in traditional powerintegrated circuits. Further, because certain embodiments may providethe advantage of being able to carry an increased amount of current,certain embodiments may allow their corresponding integrated circuits toexperience lower power dissipation losses

FIG. 1 illustrates a cross section view of a Heterojunction SchottkyGate Bipolar Transistor (HSGBT) 100, in accordance with certainembodiments of the present invention.

Referring to FIG. 1, a P+ Collector region 120 is heavily doped withp-type impurities. P+ Collector region 120 is responsible for minoritycarrier injection into an N− drift region 110. The placement of anAlGaAs region 140 over the very lightly doped/undoped Body region issignificant because the AlGaAs region 140 aids in the formation of aquantum channel through which electrons can move quickly. The Emitterregion 150 is heavily doped with n-type impurities. The Emitter region150 has a high density of electrons which move towards the N− driftregion 110 and/or towards a lightly-doped/undoped region 130, upon theapplication of proper emitter voltage.

N− Drift region 110 is lightly doped with the n-type impurities. N−Driftregion 110 is the region that collects the electrons flowing throughemitter region and the minority carriers injected from P+ collectorregions.

The device (of FIG. 1) may be optically-controlled by a light source(such as, for example, laser beam 101), as described above. In certainembodiments, HSGBT device 100 may be responsive to a range of visiblelight. In the example of FIG. 1, HSGBT 100 may be responsive to emittedlight from laser beam 101, where the light of laser beam 101 may have awavelength of 0.6 μm. Laser beam 101 may also comprise a 0.9 mW lightsource.

The energy of photons of the laser beam 101 that is used to control theHSGBT device 100 should be able to excite the electrons in theilluminated region, and, therefore, the energy of photons generateelectron-hole pairs. Some of the additionally-generated electrons aretransferred to the quantum-well. Therefore, the energy of the incidentphotons should be equal to or greater than the bandgap of the material,in this case, the bandgap of AlGaAs. The laser beam that is used in theexample of FIG. 1 has the energy of 2.06 eV, which is sufficient toexcite the electrons in the Aluminum Gallium Arsenide (AlGaAs) at thegate region, which has a band gap energy of 1.99 eV.

FIG. 1 illustrates different regions/layers of the HSGBT device 100 andthe respective dopings of the different regions/layers. With certainembodiments, HSGBT 100 may include lightly doped (N−) drift region/layer110. The N− drift region/layer 110 may comprise a semiconductormaterial. For example, with certain embodiments, N− drift region/layer110 may comprise a III-V direct bandgap semiconductor such as GalliumArsenide (GaAs), for example. HSGBT 100 may also include P+ dopedcollector region 120. The “N−” notation at the drift region generallyindicates that the region is doped lightly with n-type impuritiesrelative to the other regions marked with “n+”, which are heavily dopedwith n-type impurities. The “P+” at the collector region indicates thatthe collector region is heavily doped with p-type impurities. HSGBTdevice 100 may also include lightly-doped/undoped region 130. Thelightly-doped/undoped region 130 may be lightly doped and/or may beundoped. Further, HSGBT device 100 may also include n+ doped region 150.

With certain embodiments, HSGBT 100 may also include a heterostructure140. Heterostructure 140 may comprise a semiconductor material that isdifferent than the semiconductor material of the N− drift region 110.For example, with certain embodiments, heterostructure 140 may compriseAluminum gallium arsenide (AlGaAs), while N− drift region 110 maycomprise Gallium arsenide (GaAs). Each embodiment of present inventionmay use different alloys between Al and Ga. For example, the example ofFIG. 1 utilizes an alloy where Al is 0.47, and Ga is 0.53. With otherembodiments, heterostructure 140 may comprise Indium gallium arsenide orother types of III-V semiconductors, for example.

As illustrated by FIG. 1, at least one heterojunction may be formedbetween the N− drift region 110 and the heterostructure 140. In thiscase, the heterojunction is formed between Aluminum Gallium Arsenide(AlGaAs) and Gallium Arsenide (GaAs) (of the Body region of HSGBT 100).AlGaAs may be an alloy where a fractional composition of Al is 0.47 andthe fraction composition of Ga is 0.53. Although this fractionalcomposition is specifically mentioned, other embodiments may usedifferent fraction compositions of different materials. AlGaAs is a wideband gap material and heavily doped. The GaAs material used in the bodyregion may be undoped/very lightly doped. When a junction is formedbetween the GaAs and the AlGaAs, the junction results in the formationof a quantum channel where electrons can move freely and quickly.

As illustrated by FIG. 1, with certain embodiments, HSGBT device 100 mayalso include a collector terminal 150 that is in contact with the P+doped collector region/layer 120. HSGBT device 100 may also include agate terminal 160 that is in contact with heterostructure 140. HSGBT 100may also include an emitter terminal 170 that is in contact with thelightly-doped/undoped region 130 and/or with n+ doped region 150. Theemitter terminal 170 is in contact with both the n+ doped region 150 andthe lightly-doped/undoped region 130.

FIG. 2 illustrates doping densities in different regions of a siliconplanar insulated gate bipolar transistor (IGBT). As illustrated by FIG.2, a top portion of the silicon planar IGBT may include portions ofSilicon dioxide (SiO₂). The silicon planar IGBT may also include acollector, a gate, and an emitter. As illustrated by FIG. 2, the areasurrounding the collector and the area surrounding the emitter may haven-type doping.

FIG. 3 illustrates doping densities in different regions of a GalliumArsenide (GaAs) IGBT. The GaAs IGBT may also include a collector, agate, and an emitter. As illustrated by FIG. 3, the area surrounding thecollector may have p-type doping and the area surrounding the emittermay have n-type doping.

FIG. 4 illustrates doping densities in the different regions of an HSGBTdevice 100, in accordance with certain embodiments of the presentinvention. With certain embodiments, the area surrounding the collector150 (such as P+ doped collector region 120, for example) may have p-typedoping. The p-type doping in the area surrounding the collector may havea doping concentration between around 10¹² cm³ and around 10²⁰ cm³, forexample. The p-type doping in the area surrounding the collector may bebetween a depth of 0 to around 10 microns. The area surrounding the gate160 and emitter 170 may have lighter p-type doping (i.e.,lightly-doped/undoped region 130). The lighter p-type doping in the areasurrounding the gate and emitter may be between a depth of 0 to around 5microns. The p-type doping in the area surrounding the gate 160 andemitter 170 may have a concentration around 10¹² cm³, for example. Asillustrated by FIG. 4, n-doped drift region 110 may have n-type doping,with a concentration between around 10¹⁴¹ cm³ and around 10¹⁷³ cm³, forexample.

FIG. 5(a) illustrates a current in an HSGBT device, when controlledelectrically, in accordance with certain embodiments. As can be seen byFIG. 5(a), the current is 0.016 A. FIG. 5(a) illustrates current-voltagecharacteristics of HSGBT without light illumination.

FIG. 5(b) illustrates a current in an HSGBT device, when controlledoptically, in accordance with certain embodiments. As can be seen byFIG. 5(b), the current is 0.04 A. FIG. 5(b) illustrates current-voltagecharacteristics of optically-controlled HSGBT.

From the I-V characteristics of FIGS. 5(a) and 5(b), it is evident thatthe current in the HSGBT device that is controlled optically is higherthan in the device that is not optically controlled. The device, whencontrolled optically, may carry a current that is 2.5 times higher. Moreimportantly, the device can turn on without application of any gatevoltage. Rather, the devices of certain embodiments may be turned on bysimply shining light on the devices. These characteristics may make thedevice optically controllable. In this case, the light may play the roleof the gate voltage, in the absence of the gate voltage.

The HSGBT devices (whether they are optically-controlled or whether theyare without light illumination), may provide higher levels of collectorcurrent, as compared to the traditional silicon planar IGBT and GalliumArsenide IGBT devices. The HSGBT device of certain embodiments, due toits construction, exhibits higher levels of collector current ascompared to other traditional devices. The HSGBT device that iscontrolled optically may be found to have slightly higher currents thanthe device that is not optically controlled due to a generation of alarger number of electron-hole pairs by light illumination in theoptically controlled device.

As described above, the Optically Controlled Schottky Gate BipolarTransistor (OC HSGBT) of certain embodiments may function as a smartpower optical device, which provides their corresponding circuits with alower power loss. OC HSGBT may be utilized in smart power integratedcircuits, as well as in high power opto-electronic circuits.

As described above, certain embodiments of the present invention mayexhibit lower power losses, while providing a higher capability forcarrying current. The heterojunction formed between a heavily-dopedwide-bandgap AlGaAs and a very lightly-doped narrow-bandgap GaAs mayresult in the formation of a quantum well in the conduction band of theGaAs material. This quantum well has a higher concentration of electronsbecause of the real-space electron transfer from AlGaAs to the quantumwell. The electrons in the quantum well are subject to reducedelectron-ionized impurity scattering. The electrons there moverelatively faster and thereby result in a higher current carryingcapacity. Certain embodiments may have the flexibility to be controlledoptically, as well as the ability to be controlled electrically. Assuch, certain embodiments may be used within high power circuitapplications, including applications where IGBTs are being used, as wellas within applications with high power optical communication circuitsand systems.

The previous approaches generally used surface and bulk transport ofelectrons. As described above, embodiments of the present invention mayuse a real space electron transfer and transport through a quantum well.The quantum well may be formed at a heterojunction formed between wideand narrow bandgap semiconductors. Additionally, the device of certainembodiments may be controlled optically, unlike the devices thatpresently exist.

With regard to the implementation of certain embodiments, high qualityGaAs and AlGaAs heterostructures can be grown on a GaAs(Si) substrateusing a molecular beam epitaxy process. For p-type doping, Beryllium maybe used. For n-type doping, Silicon may be used.

Further device layers may be created by standard photolithographic andwet chemical etching techniques. Different methods of fabricating theabove-described device may involve different fabrication techniques. Forcertain embodiments, device fabrication may start on the (110) surfaceof a GaAs heterostructure crystal with n− epitaxial layer. A devicepattern may be transferred onto the surface using photolithography (byusing, for example, photoresist, aligning, and/or developing of thepattern), followed by a wet etching process. Next, the collector andemitter of device may be lightly doped. Finally, a heavily doped AlGaAsgate may be grown using, for example, molecular-beam epitaxy.

FIG. 6 illustrates a method of fabricating a device, in accordance withcertain embodiments of the present invention. The method may fabricate atransistor structure. The method, at 610, includes performing aphotolithography process to transfer a device pattern onto asemiconductor substrate. The semiconductor substrate may include a driftregion and a lightly-doped/undoped region. The lightly-doped/undopedregion may be lightly-doped and/or undoped. The method, at 620, includesdoping a collector region of the substrate. The method, at 630, includesdoping an emitter region of the substrate. The method, at 640, includesforming a heterostructure. The heterostructure forms a heterojunctionwith the lightly-doped/undoped region. The method, at 650, includesforming a collector terminal. The collector terminal is in contact withthe collector region. The method, at 660, includes forming a gateterminal. The gate terminal may be in contact with the heterostructure.The method may also include, at 670, forming an emitter terminal. Theemitter terminal is in contact with the lightly-doped/undoped region andthe emitter region.

The described features, advantages, and characteristics of the inventioncan be combined in any suitable manner in one or more embodiments. Oneskilled in the relevant art will recognize that the invention can bepracticed without one or more of the specific features or advantages ofa particular embodiment. In other instances, additional features andadvantages can be recognized in certain embodiments that may not bepresent in all embodiments of the invention. One having ordinary skillin the art will readily understand that the invention as discussed abovemay be practiced with steps in a different order, and/or with hardwareelements in configurations which are different than those which aredisclosed. Therefore, although the invention has been described basedupon these preferred embodiments, it would be apparent to those of skillin the art that certain modifications, variations, and alternativeconstructions would be apparent, while remaining within the spirit andscope of the invention.

We claim:
 1. A method for fabricating a transistor structure, the methodcomprising: performing a photolithography process to transfer a devicepattern onto a semiconductor substrate, wherein the semiconductorsubstrate comprises a drift region and a lightly-doped/undoped region,and the lightly-doped/undoped region is lightly-doped and/or undoped;doping a collector region of the substrate; doping an emitter region ofthe substrate; forming a heterostructure, wherein the heterostructureforms a heterojunction with the lightly-doped/undoped region; forming acollector terminal, wherein the collector terminal is in contact withthe collector region; forming a gate terminal, wherein the gate terminalis in contact with the heterostructure; and forming an emitter terminal,wherein the emitter terminal is in contact with thelightly-doped/undoped region and the emitter region.
 2. The methodaccording to claim 1, wherein the drift region comprises an N− dopedregion.
 3. The method according to claim 1, wherein the doping thecollector region comprises performing P+ doping.
 4. The method accordingto claim 1, wherein the doping the emitter region comprises performingn+ doping.
 5. The method according to claim 1, wherein the semiconductorsubstrate comprises Gallium arsenide.
 6. The method according to claim1, wherein the forming the heterostructure comprises forming aheterostructure comprising Aluminum gallium arsenide.
 7. The methodaccording to claim 1, wherein the forming the heterostructure comprisesforming an n+ doped heterostructure.
 8. The method according to claim 1,wherein fabricating the transistor structure comprises fabricating astructure that is optically-controllable via illumination upon the gateterminal.
 9. The method according to claim 1, wherein fabricating thetransistor structure comprises fabricating a structure where a quantumwell corresponding to the heterojunction provides a low resistancechannel for a flow of electrons.